NXP Semiconductors electronic components — RF discretes (BFG/BFQ/BSR/PMBF), PowerQUICC MC8641D, S912ZVML, R01/RN3 analog & secure-interface devices (CBTU, NX3, PCA, PCF, SA604, SC28L194), Oak Hill motion/pressure sensors (MMA1631, NPS3000), SC26C92/SC28L9x UARTs, RC3-process SA6xx RF and PCF2119 LCD parts, MPX/MPXM pressure sensors, FXLS6XXXX accelerometers, LPC29xx ARM9 microcontrollers, PTN33xx SFI parts, i.MX7ULP Rev B1 silicon, MPC555, MC33886/MC33887/MC33931/MC33932 HSOP H-bridge drivers, MCZ33781/MCZ33784 DBUS2 interface products, FS26 safety SBCs (with eFS26 successors), and SPC5/MPC55xx automotive processors.
| Section | Records |
|---|---|
| DN 201701040DN — Product Discontinuation Notice (13 records) | 13 |
| DN 201905028DN — Discontinuation for NXP R01 High Performance Analog and RN3 Secure Interface Devices (13 records) | 13 |
| DN 202010061DN — Oak Hill Fab Scale Down: Motion and Pressure Sensors (2 records) | 2 |
| DN 202202019DN — NXP R01 and RN3 2022 1Q Misc Discontinuation Notice (6 records) | 6 |
| DN 202208013DN — RC3 Process Discontinuation (12 records) | 12 |
| DN 202209009DN — Discontinuation Notification for Pressure Sensor Parts (19 records) | 19 |
| DN 202301007DN — FXLS6XXXX Product Family Discontinuation Notification (7 records) | 7 |
| DN 202305007DN — LPC29xx Product Discontinuance (8 records) | 8 |
| DN 202307015DN — Discontinuation of Various Parts under SFI (7 records) | 7 |
| DN 202311014DN — i.MX7ULP Rev B1 Silicon Discontinuation Notification (3 records) | 3 |
| DN 202402009DN — MPC555 Product Discontinuance (6 records) | 6 |
| DN 202502006DN — Discontinuation Notification for NXP Driver & Energy Systems HSOP Package Products (8 records) | 8 |
| DN 202508007DN — Discontinuation Notification for NXP Analog Power & Networking Distributed System Interface Bus 2.0 (DBUS2) Products (4 records) | 4 |
| DN 202512015DN — Discontinuation Notification for NXP Safety & Power Management FS26 Products and Migration to eFS26 Products (82 records) | 82 |
| DN 202604013DN — NXP Automotive Processors Discontinuation of Select Legacy Devices (65 records) | 65 |
| DN | Part Number | 12NC | Discontinuation Type | Availability | Source |
|---|---|---|---|---|---|
| 201701040DN | BFG21W,115 | 934047480115 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | BFG31,115 | 934000180115 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | BFG403W,115 | 934047450115 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | BFG410W,115 | 934047460115 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | BFG410W,135 | 934047460135 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | BFQ149,115 | 933897220115 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | BSR56,215 | 933410740215 | FULL WITHDRAWAL | Standard End of Life | Sole Source |
| 201701040DN | MC8641DHX1500KE | 935314128557 | VERSION WITHDRAWAL | Non-Manufacturable | Sole Source |
Sample rows are copied verbatim from the paid dataset file.
All 255 records are in the NXP Semiconductors — Electronic Component EOL & Migration Dataset v1 file.
Price: 0.01 USDC · Protocol: HTTP 402 (x402, Base) · GET /data/nxp-eol-migration-v1.md → 402 → pay → 200
Get the full dataset (0.01 USDC) · All NXP Semiconductors datasets
How do I check whether a specific NXP Semiconductors part is in this dataset?
Open the free sample records on the dataset page first — they are copied verbatim from the paid file. The full file lists every record with its source notice, so you can confirm coverage of your exact part number before relying on the cross-reference.
What does last time buy (LTB) mean?
The last date the manufacturer accepts orders for a discontinued part. After it passes, the part is only available from remaining distributor stock or the secondary market — which is exactly when a verified replacement cross-reference matters most.
Are the recommended replacements drop-in compatible?
Not necessarily. Manufacturers' own notices sometimes warn that a recommended replacement is not pin or voltage compatible and requires a board redesign. Where the source notice prints such a warning, it is carried in the dataset — always check the replacement's package and key specs against your design.
Where does this data come from?
Every record is extracted from a NXP Semiconductors document — the manufacturer's own lifecycle, discontinuation, PCN/PDN notices and the affected-part lists they publish — downloaded from the manufacturer's own channels. No part number, date or replacement is inferred; if the manufacturer did not print it, it is not in the file.
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